Manufacturing Capability

Millennium Substrates’ proprietary thick film process, ThermAL™ enables us to produce advanced products which cover a wide range of applications such as optical, thermal, RF as well as hermetic products for IC packaging.

We can deposit a wide range of materials on our substrates including electrical conductor, gold wire bondable metal, dielectric or B-Stage epoxy.

We can metallise electrical traces on technical ceramic, glass, aluminum and steel. Electrical or thermal via can be made with laser and filled with silver to improve the electrical as well as thermal property.

Our patented heat dissipation technology, ThermAL™, Outperforms MCPCB & other conventional substrates.

Contact us for more information.

Our Products